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South America Semiconductor Bonding Market Forecast to 2028 - COVID-19 Impact and Regional Analysis by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Application (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND)
- Report Code : BMIRE00027603
- Pages : 106
The semiconductor bonding market in South America is expected to grow from US$ 16.23 million in 2022 to US$ 18.82 million by 2028. It is estimated to grow at a CAGR of 2.5% from 2022 to 2028.
Rising Demand for Hybrid Bonding
The growing need for I/O density and faster connections between chips is transforming system designs that include 3D architectures and hybrid bonding. Hybrid bonding connects power and signal-carrying copper pads and the surrounding dielectric through die-to-wafer or wafer-to-wafer connections, providing up to 1,000X more connections than copper microbumps. While accelerating bump density by three orders of magnitude above 2.5D integration techniques, it reduces signal delay to approximately nonexistent levels. Hybrid bonding is currently only used in a few high-end applications, such as processor/cache and HBM (High Bandwidth Memory), but it is expected that its adoption will increase in 3D DRAM, RF modems, and GaN/Si bonding for microLEDs. Hybrid bonding presents a practical alternative to transistor node scaling, where high performance is required. Thus, to meet the enormous demand from high-end processors, HBM, microLED, and other applications, hybrid bonding will create a lucrative opportunity for the growth of the South America semiconductor bonding market during the forecast period. Moreover, various market players are forming joint ventures and agreements to cater to the growing demand for hybrid bonding. Thus, various collaborative approaches by the market players in bringing forward the hybrid bonding technology will further lead to the growth of the South America semiconductor bonding market during the forecast period.
Market Overview
Brazil, Argentina, and the Rest of South America are the key contributors to the semiconductor bonding market in the South America. The increasing demand for CMOS image sensors in machine vision systems is driving the need for semiconductor bonding equipment. The market growth is attributed to the growing demand for high-quality cameras in smartphones and tablets and the increasing application of image sensors in the medical diagnostic & image sensor, automotive, and other sectors. However, the complex manufacturing process of high-resolution image sensors and higher power consumption in CCD image sensors are hindering the growth of the South America semiconductor bonding market. The upcoming developments in the end user industries such as aerospace & defense, consumer electronics, healthcare, automotive, and telecommunications are boosting the market growth in the region. For instance, the future of the automotive industry in Brazil looks promising due to the growing demand for electric vehicles (EVs), passenger cars, and commercial vehicles; increasing electronic content per vehicle; increasing vehicle production; and increasing demand for advanced vehicle safety and comfort systems. A few leading trends supporting the growth of the automotive industry in Brazil include the development of smaller single chips for radar sensors and the introduction of high-efficiency power semiconductors.
South America Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
South America Semiconductor Bonding Market Segmentation
The South America semiconductor bonding market is segmented into type, application, and country.
Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held the largest market share in 2022.
Based on country, the market is segmented into Brazil, Argentina, and the Rest of South America. Brazil dominated the market share in 2022.
ASMPT; EV Group; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the South America region.
TABLE OF CONTENTS
1. Introduction
1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. SAM Semiconductor Bonding Market Landscape
4.1 Market Overview
4.2 SAM PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinions
5. SAM Semiconductor Bonding Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Adoption of Stacked Die Technology in IoT Devices
5.1.2 Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
5.2 Market Restraints
5.2.1 Fluctuation in the Price of Semiconductor Components
5.3 Market Opportunities
5.3.1 Rising Demand for Hybrid Bonding
5.4 Future Trends
5.4.1 Adoption of Die Bonding in Telecommunication
5.5 Impact Analysis of Drivers and Restraints
6. Semiconductor Bonding Market – SAM Market Analysis
6.1 SAM Semiconductor Bonding Market Overview
6.2 SAM Semiconductor Bonding Market Revenue Forecast and Analysis
7. Semiconductor Bonding Market Revenue and Forecast to 2028 – Type
7.1 SAM Semiconductor Bonding Market, By Type (2021 And 2028)
7.2 Die Bonder
7.2.1 Overview
7.2.2 Die Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.3 Wafer Bonder
7.3.1 Overview
7.3.2 Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.4 Flip Chip Bonder
7.4.1 Overview
7.4.2 Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8. SAM Semiconductor Bonding Market Revenue and Forecast to 2028 – Application
8.1 Overview
8.2 SAM Semiconductor Bonding Market, By Application (2021 And 2028)
8.3 RF Devices
8.3.1 Overview
8.3.2 RF Devices: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.4 MEMS and Sensors
8.4.1 Overview
8.4.2 MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.5 LED
8.5.1 Overview
8.5.2 LED: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.6 3D NAND
8.6.1 Overview
8.6.2 3D NAND: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.7 CMOS Image Sensors
8.7.1 Overview
8.7.2 CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
9. SAM Semiconductor Bonding Market – Country Analysis
9.1 Overview
9.1.1 SAM: Semiconductor Bonding Market, by Key Country
9.1.1.1 Brazil: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.1.1 Brazil: Semiconductor Bonding Market, by Type
9.1.1.1.2 Brazil: Semiconductor Bonding Market, by Application
9.1.1.2 Argentina: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.2.1 Argentina: Semiconductor Bonding Market, by Type
9.1.1.2.2 Argentina: Semiconductor Bonding Market, by Application
9.1.1.3 Rest of SAM: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.3.1 Rest of SAM: Semiconductor Bonding Market, by Type
9.1.1.3.2 Rest of SAM: Semiconductor Bonding Market, by Application
10. Industry Landscape
10.1 Overview
10.2 Market Initiative
10.3 New Product Launch
11. Company Profiles
11.1 Palomar Technologies
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Products and Services
11.1.4 Financial Overview
11.1.5 SWOT Analysis
11.1.6 Key Developments
11.2 Panasonic Corporation
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Products and Services
11.2.4 Financial Overview
11.2.5 SWOT Analysis
11.2.6 Key Developments
11.3 Toray Industries Inc
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Products and Services
11.3.4 Financial Overview
11.3.5 SWOT Analysis
11.3.6 Key Developments
11.4 Kulicke & Soffa Industries, Inc.
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Products and Services
11.4.4 Financial Overview
11.4.5 SWOT Analysis
11.4.6 Key Developments
11.5 ASMPT
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Products and Services
11.5.4 Financial Overview
11.5.5 SWOT Analysis
11.5.6 Key Developments
11.6 Yamaha Motor Corporation
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Products and Services
11.6.4 Financial Overview
11.6.5 SWOT Analysis
11.6.6 Key Developments
11.7 EV Group
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Products and Services
11.7.4 Financial Overview
11.7.5 SWOT Analysis
11.7.6 Key Developments
11.8 WestBond, Inc.
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Products and Services
11.8.4 Financial Overview
11.8.5 SWOT Analysis
11.8.6 Key Developments
12. Appendix
12.1 About The Insight Partners
12.2 Word Index
LIST OF TABLES
Table 1. SAM Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Table 2. Brazil: Semiconductor Bonding Market, by Type– Revenue and Forecast to 2028 (US$ Million)
Table 3. Brazil: Semiconductor Bonding Market, by Application – Revenue and Forecast to 2028 (US$ Million)
Table 4. Argentina: Semiconductor Bonding Market, by Type– Revenue and Forecast to 2028 (US$ Million)
Table 5. Argentina: Semiconductor Bonding Market, by Application – Revenue and Forecast to 2028 (US$ Million)
Table 6. Rest of SAM: Semiconductor Bonding Market, by Type – Revenue and Forecast to 2028 (US$ Million)
Table 7. Rest of SAM: Semiconductor Bonding Market, by Application – Revenue and Forecast to 2028 (US$ Million)
Table 8. List of Abbreviation
LIST OF FIGURES
Figure 1. SAM Semiconductor Bonding Market Segmentation
Figure 2. SAM Semiconductor Bonding Market Segmentation – By Country
Figure 3. SAM Semiconductor Bonding Market Overview
Figure 4. SAM Semiconductor Bonding Market, by Type
Figure 5. SAM Semiconductor Bonding Market, by Application
Figure 6. SAM Semiconductor Bonding Market, by Country
Figure 7. SAM – PEST Analysis
Figure 8. SAM Semiconductor Bonding Market- Ecosystem Analysis
Figure 9. Expert Opinions
Figure 10. SAM Semiconductor Bonding Market Impact Analysis of Drivers and Restraints
Figure 11. SAM Semiconductor Bonding Market Revenue Forecast and Analysis (US$ Million)
Figure 12. SAM Semiconductor Bonding Market, By Type (2021 and 2028)
Figure 13. SAM Die Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 14. SAM Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 15. SAM Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 16. SAM Semiconductor Bonding Market, By Application (2021 and 2028)
Figure 17. SAM RF Devices: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 18. SAM MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 19. SAM LED: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 20. SAM 3D NAND: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 21. SAM CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 22. SAM: Semiconductor Bonding Market, by Key Country – Revenue (2021) (US$ Million)
Figure 23. SAM: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
Figure 24. Brazil: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
Figure 25. Argentina: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
Figure 26. Rest of SAM: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
● Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the South America semiconductor bonding market.
● Highlights key business priorities in order to assist companies to realign their business strategies
● The key findings and recommendations highlight crucial progressive industry trends in the South America semiconductor bonding market, thereby allowing players across the value chain to develop effective long-term strategies
● Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
● Scrutinize in-depth South America market trends and outlook coupled with the factors driving the semiconductor bonding market, as well as those hindering it
● Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing, and distribution
● ASMPT
● EV Group
● Kulicke & Soffa Industries, Inc.
● Palomar Technologies
● Panasonic Corporation
● Toray Industries Inc
● WestBond, Inc.
● Yamaha Motor Corporation
At 2.5% CAGR, the South America Semiconductor Bonding Market is speculated to be worth US$ 18.82 million by 2028, says The Insight Partners
According to the Insight Partners’ research, the South America semiconductor bonding market was valued at US$ 16.23 million in 2022 and is expected to reach US$ 18.82 million by 2028, registering a CAGR of 2.5% from 2022 to 2028. Adoption of die bonding in telecommunication and rising demand for hybrid bonding are the critical factors attributed to the market expansion.
The growing demand for high-performance optical communication devices boosts 5G deployment and datacenter applications. Further, this supports 5G wireless fronthaul and next-generation Ethernet modules, which include 2x200GbE, 4x100GbE, 400GbE, and CWDM/DWDM transceivers. The demand for high-performance optical devices is also generating requirements for smaller packaging housing, rapid technology innovation, smaller chips/dies with higher density in the package, higher-volume manufacturing, quick product iterations, and an economical price point. The new requirements are also needed in lidar, AR/VR, advanced photonic sensors, MEMS, and highly integrated silicon photonics devices. For manufacturing all the above devices, successfully deploying flexible die bonding solutions with high post-bonding accuracy and great long-term stability is required. Various manufacturers are producing flexible high bonding solutions to meet this requirement. For instance, MRSI-HVM by MRSI Systems is a flexible high-speed die bonder which can achieve <±1.5 µm @ 3 sigma. Thus, with this, the company provides the best manufacturing solution for increasing volume and mix in manufacturing 5G and datacenter core devices.On the contrary, fluctuation in the price of semiconductor components hurdles the growth of South America semiconductor bonding market.Based on type, the South America semiconductor bonding market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment held 42.7% market share in 2022, amassing US$ 6.93 million. It is projected to garner US$ 7.98 million by 2028 to expand at 2.4% CAGR during 2022–2028.Based on application, the South America semiconductor bonding market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held 34.2% market share in 2022, amassing US$ 5.56 million. It is projected to garner US$ 6.79 million by 2028 to expand at 3.4% CAGR during 2022–2028.Based on country, the South America semiconductor bonding market has been categorized into Brazil, Argentina, and the Rest of South America. Our regional analysis states that Brazil captured 69.2% market share in 2022. It was assessed at US$ 11.24 million in 2022 and is likely to hit US$ 13.37 million by 2028, exhibiting a CAGR of 2.9% during the forecast period.Key players profiles in the South America semiconductor bonding market report are ASMPT; EV Group; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation, among others.
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