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Europe Semiconductor Bonding Market Forecast to 2028 – COVID-19 Impact and Regional Analysis – by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Application (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND)
- Report Code : BMIRE00027611
- Pages : 123
The semiconductor bonding market in Europe is expected to grow from US$ 215.77 million in 2022 to US$ 349.17 million by 2028. It is estimated to grow at a CAGR of 8.4% from 2022 to 2028.
Rising Adoption of Stacked Die Technology in IoT Devices
Due to the OEM’s increased need for enhanced capabilities and performance in smaller printed circuit boards (PCBs), the adoption of stacked die technology has grown in various electronic applications such as IoT and mobile devices. Stacked die refers to the placement of one chip on top of another or a spacer instead of the chip, followed by another chip. Sets of many rows of wire bonding loops are arranged, with each set connecting to a different die or spacer. Hence, remaining space after stacked die is used to fit many functionalities into a small die placement area. Thus, using stacked die technology to place the circuitry helps preserve valuable PCB space. Due to the limited workspace that PCB assembly and manufacturing companies witnessed with such extremely rigid and rigid-flex circuits, the demand for stacked die technology in IoT device is increasing. Moreover, the usage of stacked die significantly enhances design processes of semiconductor. The stacked die technology is used to produce a small-sized final design. One of the main factors causing the stacked die technique to advance is handheld electronic devices. Also, live tracking IoT gadget cannot be huge either. By reducing the amount of design effort and raising the likelihood of first-time success, time to market is reduced. Thus, the increasing adoption of stacked die technology in IoT devices is raising the demand for semiconductor bonding solutions in the market. In addition, OEMs in the semiconductor sector are utilizing the benefits of IoT beyond connectivity. Sensors, RFID tags, smart beacons, smart meters, and distribution control systems are IoT devices and technologies that are increasingly being used in various applications such as building and home automation, connected logistics, smart manufacturing, smart retail, smart mobility, and smart transportation. In Internet of Things (IoT) devices, semiconductor bonding techniques are utilized to compactly attach several stacked dies to substrates which will lead to the growth of the Europe semiconductor bonding market.
Market Overview
Germany, France, Italy, Russia, the UK, and rest of Europe are the key contributors to the semiconductor bonding market in the Europe. A stacked die is an assembly technique where two or more die is stacked and bonded in a single semiconductor package. It is used on a substrate having numerous functionalities around the same placement area. The performance of electrical devices is enhanced due to die piling. Thus, the utilization of stacked die is one of the major drivers accelerating the market growth. EV Group, HUTEM are a few of the prominent companies operating in the Europe semiconductor bonding market. These companies are majorly focusing on the market for MEMS sensors, CMOS image sensors, and RF devices. For instance, in March 2022, Merck KGaA, a Germany-based pharmaceutical company, announced a total investment of US$ 82 million to build a new semiconductor facility in Zhangjiagang, China. The growth of wafer bonding is fueled by the growing demand for various thermal imaging applications, including night vision systems for military and security use, imaging systems to improve building construction, thermal cameras for pedestrian protection systems in automobiles, and process monitoring systems for several commercial and industrial applications. MEMS manufacturers need advanced process equipment and expertise that will enable them to produce microbolometers at high throughput and yield for achieving the unit cost reductions required to meet the demand. The usage of EV Group’s (EVG) fully automated GEMINI wafer bonder provides cost-effective production of microbolometers. Similarly, in October 2020, in Austria, EVG established a complete process flow for combined die-to-wafer (D2W) hybrid and fusion bonding with sub-2μm placement accuracy for 3D semiconductor packaging.
Europe Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Europe Semiconductor Bonding Market Segmentation
The Europe semiconductor bonding market is segmented into type, application, and country.
Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022.
Based on country, the market is segmented into Germany, France, Italy, Russia, the UK, and rest of Europe. Germany dominated the market share in 2022. ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the Europe region.
TABLE OF CONTENTS
1. Introduction
1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. Europe Semiconductor Bonding Market Landscape
4.1 Market Overview
4.2 Europe PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinions
5. Europe Semiconductor Bonding Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Adoption of Stacked Die Technology in IoT Devices
5.1.2 Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
5.2 Market Restraints
5.2.1 Fluctuation in the Price of Semiconductor Components
5.3 Market Opportunities
5.3.1 Rising Demand for Hybrid Bonding
5.4 Future Trends
5.4.1 Adoption of Die Bonding in Telecommunication
5.5 Impact Analysis of Drivers and Restraints
6. Semiconductor Bonding Market – Europe Market Analysis
6.1 Europe Semiconductor Bonding Market Overview
6.2 Europe Semiconductor Bonding Market Revenue Forecast and Analysis
7. Europe Semiconductor Bonding Market Revenue and Forecast to 2028 – Type
7.1 Europe Semiconductor Bonding Market, By Type (2021 And 2028)
7.2 Die Bonder
7.2.1 Overview
7.2.2 Die Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.3 Wafer Bonder
7.3.1 Overview
7.3.2 Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
7.4 Flip Chip Bonder
7.4.1 Overview
7.4.2 Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8. Europe Semiconductor Bonding Market Revenue and Forecast to 2028 – Application
8.1 Overview
8.2 Europe Semiconductor Bonding Market, By Application (2021 And 2028)
8.3 RF Devices
8.3.1 Overview
8.3.2 RF Devices: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.4 MEMS and Sensors
8.4.1 Overview
8.4.2 MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.5 LED
8.5.1 Overview
8.5.2 LED: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.6 3D NAND
8.6.1 Overview
8.6.2 3D NAND: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
8.7 CMOS Image Sensors
8.7.1 Overview
8.7.2 CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast To 2028 (US$ Million)
9. Europe Semiconductor Bonding Market – Country Analysis
9.1 Overview
9.1.1 Europe: Semiconductor Bonding Market, by Key Country
9.1.1.1 France: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.1.1 France: Semiconductor Bonding Market, by Type
9.1.1.1.2 France: Semiconductor Bonding Market, by Application
9.1.1.2 Germany: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.2.1 Germany: Semiconductor Bonding Market, by Type
9.1.1.2.2 Germany: Semiconductor Bonding Market, by Application
9.1.1.3 Italy: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.3.1 Italy: Semiconductor Bonding Market, by Type
9.1.1.3.2 Italy: Semiconductor Bonding Market, by Application
9.1.1.4 UK: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.4.1 UK: Semiconductor Bonding Market, by Type
9.1.1.4.2 UK: Semiconductor Bonding Market, by Application
9.1.1.5 Russia: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.5.1 Russia: Semiconductor Bonding Market, by Type
9.1.1.5.2 Russia: Semiconductor Bonding Market, by Application
9.1.1.6 Rest of Europe: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
9.1.1.6.1 Rest of Europe: Semiconductor Bonding Market, by Type
9.1.1.6.2 Rest of Europe: Semiconductor Bonding Market, by Application
10. Industry Landscape
10.1 Overview
10.2 Market Initiative
10.3 New Product Launch
11. Company Profiles
11.1 Palomar Technologies
11.1.1 Key Facts
11.1.2 Business Description
11.1.3 Products and Services
11.1.4 Financial Overview
11.1.5 SWOT Analysis
11.1.6 Key Developments
11.2 Panasonic Corporation
11.2.1 Key Facts
11.2.2 Business Description
11.2.3 Products and Services
11.2.4 Financial Overview
11.2.5 SWOT Analysis
11.2.6 Key Developments
11.3 Toray Industries Inc
11.3.1 Key Facts
11.3.2 Business Description
11.3.3 Products and Services
11.3.4 Financial Overview
11.3.5 SWOT Analysis
11.3.6 Key Developments
11.4 Kulicke & Soffa Industries, Inc.
11.4.1 Key Facts
11.4.2 Business Description
11.4.3 Products and Services
11.4.4 Financial Overview
11.4.5 SWOT Analysis
11.4.6 Key Developments
11.5 DIAS Automation (HK) Ltd.
11.5.1 Key Facts
11.5.2 Business Description
11.5.3 Products and Services
11.5.4 Financial Overview
11.5.5 SWOT Analysis
11.5.6 Key Developments
11.6 ASMPT
11.6.1 Key Facts
11.6.2 Business Description
11.6.3 Products and Services
11.6.4 Financial Overview
11.6.5 SWOT Analysis
11.6.6 Key Developments
11.7 Yamaha Motor Corporation
11.7.1 Key Facts
11.7.2 Business Description
11.7.3 Products and Services
11.7.4 Financial Overview
11.7.5 SWOT Analysis
11.7.6 Key Developments
11.8 HUTEM
11.8.1 Key Facts
11.8.2 Business Description
11.8.3 Products and Services
11.8.4 Financial Overview
11.8.5 SWOT Analysis
11.8.6 Key Developments
11.9 EV Group
11.9.1 Key Facts
11.9.2 Business Description
11.9.3 Products and Services
11.9.4 Financial Overview
11.9.5 SWOT Analysis
11.9.6 Key Developments
11.10 WestBond, Inc.
11.10.1 Key Facts
11.10.2 Business Description
11.10.3 Products and Services
11.10.4 Financial Overview
11.10.5 SWOT Analysis
11.10.6 Key Developments
12. Appendix
12.1 About The Insight Partners
12.2 Word Index
LIST OF TABLES
Table 1. Europe Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Table 2. France: Semiconductor Bonding Market, by Type – Revenue and Forecast to 2028 (US$ Million)
Table 3. France: Semiconductor Bonding Market, by Application– Revenue and Forecast to 2028 (US$ Million)
Table 4. Germany: Semiconductor Bonding Market, by Type– Revenue and Forecast to 2028 (US$ Million)
Table 5. Germany: Semiconductor Bonding Market, by Application– Revenue and Forecast to 2028 (US$ Million)
Table 6. Italy: Semiconductor Bonding Market, by Type – Revenue and Forecast to 2028 (US$ Million)
Table 7. Italy: Semiconductor Bonding Market, by Application– Revenue and Forecast to 2028 (US$ Million)
Table 8. UK: Semiconductor Bonding Market, by Type – Revenue and Forecast to 2028 (US$ Million)
Table 9. UK: Semiconductor Bonding Market, by Application– Revenue and Forecast to 2028 (US$ Million)
Table 10. Russia: Semiconductor Bonding Market, by Type– Revenue and Forecast to 2028 (US$ Million)
Table 11. Russia: Semiconductor Bonding Market, by Application– Revenue and Forecast to 2028 (US$ Million)
Table 12. Rest of Europe: Semiconductor Bonding Market, by Type– Revenue and Forecast to 2028 (US$ Million)
Table 13. Rest of Europe: Semiconductor Bonding Market, by Application– Revenue and Forecast to 2028 (US$ Million)
Table 14. List of Abbreviation
LIST OF FIGURES
Figure 1. Europe Semiconductor Bonding Market Segmentation
Figure 2. Europe Semiconductor Bonding Market Segmentation – By Country
Figure 3. Europe Semiconductor Bonding Market Overview
Figure 4. Europe Semiconductor Bonding Market, by Type
Figure 5. Europe Semiconductor Bonding Market, by Application
Figure 6. Europe Semiconductor Bonding Market, by Country
Figure 7. Europe – PEST Analysis
Figure 8. Europe Semiconductor Bonding Market- Ecosystem Analysis
Figure 9. Expert Opinions
Figure 10. Europe Semiconductor Bonding Market Impact Analysis of Drivers and Restraints
Figure 11. Europe Semiconductor Bonding Market Revenue Forecast and Analysis (US$ Million)
Figure 12. Europe Semiconductor Bonding Market, By Type (2021 and 2028)
Figure 13. Europe Die Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 14. Europe Wafer Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 15. Europe Flip Chip Bonder: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 16. Europe Semiconductor Bonding Market, By Application (2021 and 2028)
Figure 17. Europe RF Devices: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 18. Europe MEMS and Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 19. Europe LED: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 20. Europe 3D NAND: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 21. Europe CMOS Image Sensors: Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Figure 22. Europe: Semiconductor Bonding Market, by Key Country- Revenue (2021) (US$ Million)
Figure 23. Europe: Semiconductor Bonding Market Revenue Share, by Key Country (2021 and 2028)
Figure 24. France: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
Figure 25. Germany: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
Figure 26. Italy: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
Figure 27. UK: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
Figure 28. Russia: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
Figure 29. Rest of Europe: Semiconductor Bonding Market – Revenue and Forecast to 2028 (US$ Million)
● Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the Europe semiconductor bonding market.
● Highlights key business priorities in order to assist companies to realign their business strategies
● The key findings and recommendations highlight crucial progressive industry trends in the Europe semiconductor bonding market, thereby allowing players across the value chain to develop effective long-term strategies
● Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
● Scrutinize in-depth Europe market trends and outlook coupled with the factors driving the semiconductor bonding market, as well as those hindering it
● Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing, and distribution
● ASMPT
● DIAS Automation (HK) Ltd.
● EV Group
● HUTEM
● Kulicke & Soffa Industries, Inc.
● Palomar Technologies
● Panasonic Corporation
● Toray Industries Inc
● WestBond, Inc.
● Yamaha Motor Corporation
At 8.4% CAGR, the Europe Semiconductor Bonding Market is speculated to be worth US$ 349.17 million by 2028, says The Insight Partners
According to the Insight Partners’ research, the Europe semiconductor bonding market was valued at US$ 215.77 million in 2022 and is expected to reach US$ 349.17 million by 2028, registering a CAGR of 8.4% from 2022 to 2028. Growing number of product launches, partnerships, and collaborations related to semiconductor bonding solutions is driving the growth of the market and rising adoption of stacked die technology in IoT devices are the critical factors attributed to the market expansion.
Due to the OEM’s increased need for enhanced capabilities and performance in smaller printed circuit boards (PCBs), the adoption of stacked die technology has grown in various electronic applications such as IoT and mobile devices. Stacked die refers to the placement of one chip on top of another or a spacer instead of the chip, followed by another chip. Sets of many rows of wire bonding loops are arranged, with each set connecting to a different die or spacer. Hence, remaining space after stacked die is used to fit many functionalities into a small die placement area. Thus, using stacked die technology to place the circuitry helps preserve valuable PCB space. Due to the limited workspace that PCB assembly and manufacturing companies witnessed with such extremely rigid and rigid-flex circuits, the demand for stacked die technology in IoT device is increasing. Moreover, the usage of stacked die significantly enhances design processes of semiconductor. The stacked die technology is used to produce a small-sized final design. One of the main factors causing the stacked die technique to advance is handheld electronic devices. Also, live tracking IoT gadget cannot be huge either. By reducing the amount of design effort and raising the likelihood of first-time success, time to market is reduced. Thus, the increasing adoption of stacked die technology in IoT devices is raising the demand for semiconductor bonding solutions in the market. In addition, OEMs in the semiconductor sector are utilizing the benefits of IoT beyond connectivity. Sensors, RFID tags, smart beacons, smart meters, and distribution control systems are IoT devices and technologies that are increasingly being used in various applications such as building and home automation, connected logistics, smart manufacturing, smart retail, smart mobility, and smart transportation. In Internet of Things (IoT) devices, semiconductor bonding techniques are utilized to compactly attach several stacked dies to substrates which will lead to the growth of the Europe semiconductor bonding market.
On the contrary, fluctuation in the price of semiconductor components hurdles the growth of Europe semiconductor bonding market.
Based on type, the Europe semiconductor bonding market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment held 43.0% market share in 2022, amassing US$ 92.82 million. It is projected to garner US$ 148.72 million by 2028 to expand at 8.2% CAGR during 2022–2028.
Based on application, the Europe semiconductor bonding market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held 35.2% market share in 2022, amassing US$ 75.88 million. It is projected to garner US$ 130.20 million by 2028 to expand at 9.4% CAGR during 2022–2028.
Based on country, the Europe semiconductor bonding market has been categorized into Germany, France, Italy, Russia, the UK, and the Rest of Europe. Our regional analysis states that Germany captured 30.0% market share in 2022. It was assessed at US$ 64.70 million in 2022 and is likely to hit US$ 103.39 million by 2028, exhibiting a CAGR of 8.1% during the forecast period. Key players profiles in the Europe semiconductor bonding market report are ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation, among others.
Jan 2021, ASM Pacific Technology collaborated with the EV Group (Austria) to facilitate ultra-precision die-to-wafer hybrid bonding remedies for 3D-IC diverse assimilation.
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